RED (the Radio Equipment Directive)

Chairperson - Michael Derby - American Certification Body Inc

1. Introduction to the RED and overview of compliance
   Speaker: Michael Derby (30 minutes)
2. Combining radio technology into other equipment
   Speaker: Charlie Blackham (20 minutes)
3. The Technical Documentation File
   Speaker: Michael Derby (15 minutes)
4. Common problems for manufacturers
   Speaker: Charlie Blackham  (15 minutes)
5. Questions
   Michael Derby and Charlie Blackham (10 minutes)

Transport, Systems & Installations

Chairperson - Ian MacDiarmid – Liverpool University

Topics & Speakers

1. Development and Management of EMC Specification and their Application in the Railway Environment
   Speakers TBD, ATKINS.
2. Achieving real-life whole railway system Electromagnetic compatibility using theoretical modelling and practical assessments
   Speakers TBD, ATKINS
3. The Age of “Self-Stopping” Trains!
   Preventing new rolling stock from reverting signals to red
   Speaker: Peter Brown - Project Engineering Manager - Network Rail Design Delivery.

High Power EMI

Chairperson - Richard Hoad – QinetiQ Farnborough

Topics & Speakers

1. High power RF testing of missile systems within reverberation chambers.
   Speaker: Gavin Barber - QinetiQ, Farnborough.
2. EM Disturbances to Critical Infrastructure.
   Speaker: Richard Hoad - QinetiQ, Farnborough.
3. Discussions around the Latest Changes to Standards Applicable to Ground-based and Aerospace Systems.
   Speaker: Dr Chris Jones, of BAE Systems, Warton.

Filtering for cost-effective SI, PI and EMC

How filters really work, in practice

‘Soft’ ferrites, CM filtering, real-life problems and their solutions

Earth leakage currents versus safety

Important practical issues in construction, mounting, and cabling

The need to combine filtering with shielding

Essential PCB design & layout for cost-effective SI, PI and EMC

EM Zoning, interface analysis, filtering, suppression and board-level shielding (BLS)

0V(GND) and power (PWR) planes, PCB-chassis RF-bonding

Power supply decoupling, Matched transmission line techniques

Layer stacking and trace routing

Devices with BGA packages and/or multiple DC rails

Advanced PCB design and layout for cost-effective SI, PI and EMC

Trends and their implications for PCB design/layout

Guidelines, approximations, simulations, and virtual design for SI, PI and EMC

Advanced Zoning, Interfacing, PCB-chassis bonding, Planes, and Decoupling

Co-locating radio/TV/wireless datacom antennas

The totally shielded board assembly, damping board resonances

Buried components, especially buried capacitance decoupling

Advanced transmission lines, SERDES up to 32Gb/s

Microvia (HDI) board techniques and how they save cost

3-D Moulded PCBs, Additive Manufacturing (3D printing)